Light-emitting panel and a method for making

ABSTRACT

An improved light-emitting panel having a plurality of micro-components sandwiched between two substrates is disclosed. Each micro-component contains a gas or gas-mixture capable of ionization when a sufficiently large voltage is supplied across the micro-component via at least two electrodes. An improved method of manufacturing a light-emitting panel is also disclosed, which uses a web fabrication process to manufacturing light-emitting displays as part of a high-speed, continuous incline process.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional application of and claims priority toand incorporates by reference in its entirety, application Ser. No.09/697,344, filed Oct. 27, 2000, now U.S. Pat. No. 6,612,889. Alsoreferenced hereby are the following applications which are incorporatedherein by reference in their entireties: U.S. patent application Ser.No. 09/697,358 entitled A Micro-Component for Use in a Light-EmittingPanel filed Oct. 27, 2000; U.S. patent application Ser. No. 09/697,498entitled A Method for Testing a Light-Emitting Panel and the ComponentsTherein filed Oct. 27, 2000; U.S. patent application Ser. No. 09/697,345entitled A Method and System for Energizing a Micro-Component In aLight-Emitting Panel filed Oct. 27, 2000; and U.S. patent applicationSer. No. 09/697,346 entitled A Socket for Use in a Light-Emitting Panelfiled Oct. 27, 2000.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention is relates to a light-emitting panel and methodsof fabricating the same. The present invention further relates to a webfabrication process for manufacturing a light-emitting panel.

2. Description of Related Art

In a typical plasma display, a gas or mixture of gases is enclosedbetween orthogonally crossed and spaced conductors. The crossedconductors define a matrix of cross over points, arranged as an array ofminiature picture elements (pixels), which provide light. At any givenpixel, the orthogonally crossed and spaced conductors function asopposed plates of a capacitor, with the enclosed gas serving as adielectric. When a sufficiently large voltage is applied, the gas at thepixel breaks down creating free electrons that are drawn to the positiveconductor and positively charged gas ions that are drawn to thenegatively charged conductor. These free electrons and positivelycharged gas ions collide with other gas atoms causing an avalancheeffect creating still more free electrons and positively charged ions,thereby creating plasma. The voltage level at which this ionizationoccurs is called the write voltage.

Upon application of a write voltage, the gas at the pixel ionizes andemits light only briefly as free charges formed by the ionizationmigrate to the insulating dielectric walls of the cell where thesecharges produce an opposing voltage to the applied voltage and therebyextinguish the ionization. Once a pixel has been written, a continuoussequence of light emissions can be produced by an alternating sustainvoltage. The amplitude of the sustain waveform can be less than theamplitude of the write voltage, because the wall charges that remainfrom the preceding write or sustain operation produce a voltage thatadds to the voltage of the succeeding sustain waveform applied in thereverse polarity to produce the ionizing voltage. Mathematically, theidea can be set out as V_(s)=V_(w)−V_(wall), where V_(s) is the sustainvoltage, V_(w) is the write voltage, and V_(wall) is the wall voltage.Accordingly, a previously unwritten (or erased) pixel cannot be ionizedby the sustain waveform alone. An erase operation can be thought of as awrite operation that proceeds only far enough to allow the previouslycharged cell walls to discharge; it is similar to the write operationexcept for timing and amplitude.

Typically, there are two different arrangements of conductors that areused to perform the write, erase, and sustain operations. The one commonelement throughout the arrangements is that the sustain and the addresselectrodes are spaced apart with the plasma-forming gas in between.Thus, at least one of the address or sustain electrodes is locatedwithin the path the radiation travels, when the plasma-forming gasionizes, as it exits the plasma display. Consequently, transparent orsemi-transparent conductive materials must be used, such as indium tinoxide (ITO), so that the electrodes do not interfere with the displayedimage from the plasma display. Using ITO, however, has severaldisadvantages, for example, ITO is expensive and adds significant costto the manufacturing process and ultimately the final plasma display.

The first arrangement uses two orthogonally crossed conductors, oneaddressing conductor and one sustaining conductor. In a gas panel ofthis type, the sustain waveform is applied across all the addressingconductors and sustain conductors so that the gas panel maintains apreviously written pattern of light emitting pixels. For a conventionalwrite operation, a suitable write voltage pulse is added to the sustainvoltage waveform so that the combination of the write pulse and thesustain pulse produces ionization. In order to write an individual pixelindependently, each of the addressing and sustain conductors has anindividual selection circuit. Thus, applying a sustain waveform acrossall the addressing and sustain conductors, but applying a write pulseacross only one addressing and one sustain conductor will produce awrite operation in only the one pixel at the intersection of theselected addressing and sustain conductors.

The second arrangement uses three conductors. In panels of this type,called coplanar sustaining panels, each pixel is formed at theintersection of three conductors, one addressing conductor and twoparallel sustaining conductors. In this arrangement, the addressingconductor orthogonally crosses the two parallel sustaining conductors.With this type of panel, the sustain function is performed between thetwo parallel sustaining conductors and the addressing is done by thegeneration of discharges between the addressing conductor and one of thetwo parallel sustaining conductors.

The sustaining conductors are of two types, addressing-sustainingconductors and solely sustaining conductors. The function of theaddressing-sustaining conductors is twofold: to achieve a sustainingdischarge in cooperation with the solely sustaining conductors; and tofulfill an addressing role. Consequently, the addressing-sustainingconductors are individually selectable so that an addressing waveformmay be applied to any one or more addressing-sustaining conductors. Thesolely sustaining conductors, on the other hand, are typically connectedin such a way that a sustaining waveform can be simultaneously appliedto all of the solely sustaining conductors so that they can be carriedto the same potential in the same instant.

Numerous types of plasma panel display devices have been constructedwith a variety of methods for enclosing a plasma forming gas betweensets of electrodes. In one type of plasma display panel, parallel platesof glass with wire electrodes on the surfaces thereof are spaceduniformly apart and sealed together at the outer edges with the plasmaforming gas filling the cavity formed between the parallel plates.Although widely used, this type of open display structure has variousdisadvantages. The sealing of the outer edges of the parallel plates andthe introduction of the plasma forming gas are both expensive andtime-consuming processes, resulting in a costly end product. Inaddition, it is particularly difficult to achieve a good seal at thesites where the electrodes are fed through the ends of the parallelplates. This can result in gas leakage and a shortened productlifecycle. Another disadvantage is that individual pixels are notsegregated within the parallel plates. As a result, gas ionizationactivity in a selected pixel during a write operation may spill over toadjacent pixels, thereby raising the undesirable prospect of possiblyigniting adjacent pixels. Even if adjacent pixels are not ignited, theionization activity can change the turn-on and turn-off characteristicsof the nearby pixels.

In another type of known plasma display, individual pixels aremechanically isolated either by forming trenches in one of the parallelplates or by adding a perforated insulating layer sandwiched between theparallel plates. These mechanically isolated pixels, however, are notcompletely enclosed or isolated from one another because there is a needfor the free passage of the plasma forming gas between the pixels toassure uniform gas pressure throughout the panel. While this type ofdisplay structure decreases spill over, spill over is still possiblebecause the pixels are not in total electrical isolation from oneanother. In addition, in this type of display panel it is difficult toproperly align the electrodes and the gas chambers, which may causepixels to misfire. As with the open display structure, it is alsodifficult to get a good seal at the plate edges. Furthermore, it isexpensive and time consuming to introduce the plasma producing gas andseal the outer edges of the parallel plates.

In yet another type of known plasma display, individual pixels are alsomechanically isolated between parallel plates. In this type of display,the plasma forming gas is contained in transparent spheres formed of aclosed transparent shell. Various methods have been used to contain thegas filled spheres between the parallel plates. In one method, spheresof varying sizes are tightly bunched and randomly distributed throughouta single layer, and sandwiched between the parallel plates. In a secondmethod, spheres are embedded in a sheet of transparent dielectricmaterial and that material is then sandwiched between the parallelplates. In a third method, a perforated sheet of electricallynonconductive material is sandwiched between the parallel plates withthe gas filled spheres distributed in the perforations.

While each of the types of displays discussed above are based ondifferent design concepts, the manufacturing approach used in theirfabrication is generally the same. Conventionally, a batch fabricationprocess is used to manufacture these types of plasma panels. As is wellknown in the art, in a batch process individual component parts arefabricated separately, often in different facilities and by differentmanufacturers, and then brought together for final assembly whereindividual plasma panels are created one at a time. Batch processing hasnumerous shortcomings, such as, for example, the length of timenecessary to produce a finished product. Long cycle times increaseproduct cost and are undesirable for numerous additional reasons knownin the art. For example, a sizeable quantity of substandard, defective,or useless fully or partially completed plasma panels may be producedduring the period between detection of a defect or failure in one of thecomponents and an effective correction of the defect or failure.

This is especially true of the first two types of displays discussedabove; the first having no mechanical isolation of individual pixels,and the second with individual pixels mechanically isolated either bytrenches formed in one parallel plate or by a perforated insulatinglayer sandwiched between two parallel plates. Due to the fact thatplasma-forming gas is not isolated at the individual pixel/subpixellevel, the fabrication process precludes the majority of individualcomponent parts from being tested until the final display is assembled.Consequently, the display can only be tested after the two parallelplates are sealed together and the plasma-forming gas is filled insidethe cavity between the two plates. If post production testing shows thatany number of potential problems have occurred, (e.g. poor luminescenceor no luminescence at specific pixels/subpixels) the entire display isdiscarded.

BRIEF SUMMARY OF THE INVENTION

Preferred embodiments of the present invention provide a light-emittingpanel that may be used as a large-area radiation source, for energymodulation, for particle detection and as a flat-panel display.Gas-plasma panels are preferred for these applications due to theirunique characteristics.

In one form, the light-emitting panel may be used as a large arearadiation source. By configuring the light-emitting panel to emitultraviolet (UV) light, the panel has application for curing, painting,and sterilization. With the addition of a white phosphor coating toconvert the UV light to visible white light, the panel also hasapplication as an illumination source.

In addition, the light-emitting panel may be used as a plasma-switchedphase array by configuring the panel in at least one embodiment in amicrowave transmission mode. The panel is configured in such a way thatduring ionization the plasma-forming gas creates a localized index ofrefraction change for the microwaves (although other wavelengths oflight would work). The microwave beam from the panel can then be steeredor directed in any desirable pattern by introducing at a localized areaa phase shift and/or directing the microwaves out of a specific aperturein the panel

Additionally, the light-emitting panel may be used for particle/photondetection. In this embodiment, the light-emitting panel is subjected toa potential that is just slightly below the write voltage required forionization. When the device is subjected to outside energy at a specificposition or location in the panel, that additional energy causes theplasma forming gas in the specific area to ionize, thereby providing ameans of detecting outside energy.

Further, the light-emitting panel may be used in flat-panel displays.These displays can be manufactured very thin and lightweight, whencompared to similar sized cathode ray tube (CRTs), making them ideallysuited for home, office, theaters and billboards. In addition, thesedisplays can be manufactured in large sizes and with sufficientresolution to accommodate high-definition television (HDTV). Gas-plasmapanels do not suffer from electromagnetic distortions and are,therefore, suitable for applications strongly affected by magneticfields, such as military applications, radar systems, railway stationsand other underground systems.

According to one general embodiment of the present invention, alight-emitting panel is made from two substrates, wherein one of thesubstrates includes a plurality of sockets and wherein at least twoelectrodes are disposed. At least partially disposed in each socket is amicro-component, although more than one micro-component may be disposedtherein. Each micro-component includes a shell at least partially filledwith a gas or gas mixture capable of ionization. When a sufficientlylarge voltage is applied across the micro-component the gas or gasmixture ionizes forming plasma and emitting radiation.

In another embodiment of the present invention, at least two electrodesare adhered to the first substrate, the second substrate or anycombination thereof.

In another embodiment, at least two electrodes are arranged so thatvoltage supplied to the electrodes causes at least one micro-componentto emit radiation throughout the field of view of the light-emittingpanel without the radiation crossing the electrodes.

In yet another embodiment, disposed in, or proximate to, each socket isat least one enhancement material.

Another preferred embodiment of the present invention is drawn to a webfabrication method for manufacturing light-emitting panels. In anembodiment, the web fabrication process includes providing a firstsubstrate, disposing a plurality of micro-components on the firstsubstrate, disposing a second substrate on the first substrate so the atthe micro-components are sandwiched between the first and secondsubstrates, and dicing the first and second substrates to formindividual light-emitting panels. In another embodiment, the webfabrication method includes the following process steps: amicro-component forming process; a micro-component coating process; acircuit and electrode printing process; a patterning process; amicro-component placement process; an electrode printing process; asecond substrate application and alignment process; and a panel dicingprocess.

Other features, advantages, and embodiments of the invention are setforth in part in the description that follows, and in part, will beobvious from this description, or may be learned from the practice ofthe invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other features and advantages of this invention willbecome more apparent by reference to the following detailed descriptionof the invention taken in conjunction with the accompanying drawings.

FIG. 1 depicts a portion of a light-emitting panel showing the basicsocket structure of a socket formed from patterning a substrate, asdisclosed in an embodiment of the present invention.

FIG. 2 depicts a portion of a light-emitting panel showing the basicsocket structure of a socket formed from patterning a substrate, asdisclosed in another embodiment of the present invention.

FIG. 3A shows an example of a cavity that has a cube shape.

FIG. 3B shows an example of a cavity that has a cone shape.

FIG. 3C shows an example of a cavity that has a conical frustum shape.

FIG. 3D shows an example of a cavity that has a paraboloid shape.

FIG. 3E shows an example of a cavity that has a spherical shape.

FIG. 3F shows an example of a cavity that has a cylindrical shape.

FIG. 3G shows an example of a cavity that has a pyramid shape.

FIG. 3H shows an example of a cavity that has a pyramidal frustum shape.

FIG. 3I shows an example of a cavity that has a parallelepiped shape.

FIG. 3J shows an example of a cavity that has a prism shape.

FIG. 4 shows the socket structure from a light-emitting panel of anembodiment of the present invention with a narrower field of view.

FIG. 5 shows the socket structure from a light-emitting panel of anembodiment of the present invention with a wider field of view.

FIG. 6A depicts a portion of a light-emitting panel showing the basicsocket structure of a socket formed from disposing a plurality ofmaterial layers and then selectively removing a portion of the materiallayers with the electrodes having a co-planar configuration.

FIG. 6B is a cut-away of FIG. 6A showing in more detail the co-planarsustaining electrodes.

FIG. 7A depicts a portion of a light-emitting panel showing the basicsocket structure of a socket formed from disposing a plurality ofmaterial layers and then selectively removing a portion of the materiallayers with the electrodes having a mid-plane configuration.

FIG. 7B is a cut-away of FIG. 7A showing in more detail the uppermostsustain electrode.

FIG. 8 depicts a portion of a light-emitting panel showing the basicsocket structure of a socket formed from disposing a plurality ofmaterial layers and then selectively removing a portion of the materiallayers with the electrodes having an configuration with two sustain andtwo address electrodes, where the address electrodes are between the twosustain electrodes.

FIG. 9 depicts a portion of a light-emitting panel showing the basicsocket structure of a socket formed from patterning a substrate and thendisposing a plurality of material layers on the substrate so that thematerial layers conform to the shape of the cavity with the electrodeshaving a co-planar configuration.

FIG. 10 depicts a portion of a light-emitting panel showing the basicsocket structure of a socket formed from patterning a substrate and thendisposing a plurality of material layers on the substrate so that thematerial layers conform to the shape of the cavity with the electrodeshaving a mid-plane configuration.

FIG. 11 depicts a portion of a light-emitting panel showing the basicsocket structure of a socket formed from patterning a substrate and thendisposing a plurality of material layers on the substrate so that thematerial layers conform to the shape of the cavity with the electrodeshaving an configuration with two sustain and two address electrodes,where the address electrodes are between the two sustain electrodes.

FIG. 12 is a flowchart describing a web fabrication method formanufacturing light-emitting displays as described in an embodiment ofthe present invention.

FIG. 13 is a graphical representation of a web fabrication method formanufacturing light-emitting panels as described in an embodiment of thepresent invention.

FIG. 14 shows an exploded view of a portion of a light-emitting panelshowing the basic socket structure of a socket formed by disposing aplurality of material layers with aligned apertures on a substrate withthe electrodes having a co-planar configuration.

FIG. 15 shows an exploded view of a portion of a light-emitting panelshowing the basic socket structure of a socket formed by disposing aplurality of material layers with aligned apertures on a substrate withthe electrodes having a mid-plane configuration.

FIG. 16 shows an exploded view of a portion of a light-emitting panelshowing the basic socket structure of a socket formed by disposing aplurality of material layers with aligned apertures on a substrate withelectrodes having a configuration with two sustain and two addresselectrodes, where the address electrodes are between the two sustainelectrodes.

FIG. 17 shows a portion of a socket of an embodiment of the presentinvention where the micro-component and the cavity are formed as a typeof male-female connector.

FIG. 18 shows a top down view of a portion of a light-emitting panelshowing a method for making a light-emitting panel by weaving a singlemicro-component through the entire light-emitting panel.

FIG. 19 shows a top down view of a portion of a color light-emittingpanel showing a method for making a color light-emitting panel byweaving multiple micro-components through the entire light-emittingpanel.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS OF THE INVENTION

As embodied and broadly described herein, the preferred embodiments ofthe present invention are directed to a novel light-emitting panel. Inparticular, preferred embodiments are directed to light-emitting panelsand to a web fabrication process for manufacturing light-emittingpanels.

FIGS. 1 and 2 show two embodiments of the present invention wherein alight-emitting panel includes a first substrate 10 and a secondsubstrate 20. The first substrate 10 may be made from silicates,polypropylene, quartz, glass, any polymeric-based material or anymaterial or combination of materials known to one skilled in the art.Similarly, second substrate 20 may be made from silicates,polypropylene, quartz, glass, any polymeric-based material or anymaterial or combination of materials known to one skilled in the art.First substrate 10 and second substrate 20 may both be made from thesame material or each of a different material. Additionally, the firstand second substrate may be made of a material that dissipates heat fromthe light-emitting panel. In a preferred embodiment, each substrate ismade from a material that is mechanically flexible.

The first substrate 10 includes a plurality of sockets 30. The sockets30 may be disposed in any pattern, having uniform or non-uniform spacingbetween adjacent sockets. Patterns may include, but are not limited to,alphanumeric characters, symbols, icons, or pictures. Preferably, thesockets 30 are disposed in the first substrate 10 so that the distancebetween adjacent sockets 30 is approximately equal. Sockets 30 may alsobe disposed in groups such that the distance between one group ofsockets and another group of sockets is approximately equal. This latterapproach may be particularly relevant in color light-emitting panels,where each socket in each group of sockets may represent red, green andblue, respectively.

At least partially disposed in each socket 30 is at least onemicro-component 40. Multiple micro-components may be disposed in asocket to provide increased luminosity and enhanced radiation transportefficiency. In a color light-emitting panel according to one embodimentof the present invention, a single socket supports threemicro-components configured to emit red, green, and blue light,respectively. The micro-components 40 may be of any shape, including,but not limited to, spherical, cylindrical, and aspherical. In addition,it is contemplated that a micro-component 40 includes a micro-componentplaced or formed inside another structure, such as placing a sphericalmicro-component inside a cylindrical-shaped structure. In a colorlight-emitting panel according to an embodiment of the presentinvention, each cylindrical-shaped structure holds micro-componentsconfigured to emit a single color of visible light or multiple colorsarranged red, green, blue, or in some other suitable color arrangement.

In another embodiment of the present invention, an adhesive or bondingagent is applied to each micro-component to assist in placing/holding amicro-component 40 or plurality of micro-components in a socket 30. Inan alternative embodiment, an electrostatic charge is placed on eachmicro-component and an electrostatic field is applied to eachmicro-component to assist in the placement of a micro-component 40 orplurality of micro-components in a socket 30. Applying an electrostaticcharge to the micro-components also helps avoid agglomeration among theplurality of micro-components. In one embodiment of the presentinvention, an electron gun is used to place an electrostatic charge oneach micro-component and one electrode disposed proximate to each socket30 is energized to provide the needed electrostatic field required toattract the electrostatically charged micro-component.

Alternatively, in order to assist placing/holding a micro-component 40or plurality of micro-components in a socket 30, a socket 30 may containa bonding agent or an adhesive. The bonding agent or adhesive may beapplied to the inside of the socket 30 by differential stripping,lithographic process, sputtering, laser deposition, chemical deposition,vapor deposition, or deposition using ink jet technology. One skilled inthe art will realize that other methods of coating the inside of thesocket 30 may be used.

In its most basic form, each micro-component 40 includes a shell 50filled with a plasma-forming gas or gas mixture 45. Any suitable gas orgas mixture 45 capable of ionization may be used as the plasma-forminggas, including, but not limited to, krypton, xenon, argon, neon, oxygen,helium, mercury, and mixtures thereof. In fact, any noble gas could beused as the plasma-forming gas, including, but not limited to, noblegases mixed with cesium or mercury. One skilled in the art wouldrecognize other gasses or gas mixtures that could also be used. In acolor display, according to another embodiment, the plasma-forming gasor gas mixture 45 is chosen so that during ionization the gas willirradiate a specific wavelength of light corresponding to a desiredcolor. For example, neon-argon emits red light, xenon-oxygen emits greenlight, and krypton-neon emits blue light. While a plasma-forming gas orgas mixture 45 is used in a preferred embodiment, any other materialcapable of providing luminescence is also contemplated, such as anelectro-luminescent material, organic light-emitting diodes (OLEDs), oran electro-phoretic material.

The shell 50 may be made from a wide assortment of materials, including,but not limited to, silicates, polypropylene, glass, any polymeric-basedmaterial, magnesium oxide and quartz and may be of any suitable size.The shell 50 may have a diameter ranging from micrometers to centimetersas measured across its minor axis, with virtually no limitation as toits size as measured across its major axis. For example, acylindrical-shaped micro-component may be only 100 microns in diameteracross its minor axis, but may be hundreds of meters long across itsmajor axis. In a preferred embodiment, the outside diameter of theshell, as measured across its minor axis, is from 100 microns to 300microns. In addition, the shell thickness may range from micrometers tomillimeters, with a preferred thickness from 1 micron to 10 microns.

When a sufficiently large voltage is applied across the micro-componentthe gas or gas mixture ionizes forming plasma and emitting radiation.The potential required to initially ionize the gas or gas mixture insidethe shell 50 is governed by Paschen's Law and is closely related to thepressure of the gas inside the shell. In the present invention, the gaspressure inside the shell 50 ranges from tens of torrs to severalatmospheres. In a preferred embodiment, the gas pressure ranges from 100torr to 700 torr. The size and shape of a micro-component 40 and thetype and pressure of the plasma-forming gas contained therein, influencethe performance and characteristics of the light-emitting panel and areselected to optimize the panel's efficiency of operation.

There are a variety of coatings 300 and dopants that may be added to amicro-component 40 that also influence the performance andcharacteristics of the light-emitting panel. The coatings 300 may beapplied to the outside or inside of the shell 50, and may eitherpartially or fully coat the shell 50. Types of outside coatings include,but are not limited to, coatings used to convert UV light to visiblelight (e.g. phosphor), coatings used as reflecting filters, and coatingsused as band-gap filters. Types of inside coatings include, but are notlimited to, coatings used to convert UV light to visible light (e.g.phosphor), coatings used to enhance secondary emissions and coatingsused to prevent erosion. One skilled in the art will recognize thatother coatings may also be used. The coatings 300 may be applied to theshell 50 by differential stripping, lithographic process, sputtering,laser deposition, chemical deposition, vapor deposition, or depositionusing ink jet technology. One skilled in the art will realize that othermethods of coating the inside and/or outside of the shell 50 may beused. Types of dopants include, but are not limited to, dopants used toconvert UV light to visible light (e.g. phosphor), dopants used toenhance secondary emissions and dopants used to provide a conductivepath through the shell 50. The dopants are added to the shell 50 by anysuitable technique known to one skilled in the art, including ionimplantation. It is contemplated that any combination of coatings anddopants may be added to a micro-component 40. Alternatively, or incombination with the coatings and dopants that may be added to amicro-component 40, a variety of coatings 350 may be coated on theinside of a socket 30. These coatings 350 include, but are not limitedto, coatings used to convert UV light to visible light, coatings used asreflecting filters, and coatings used as band-gap filters.

In an embodiment of the present invention, when a micro-component isconfigured to emit UV light, the UV light is converted to visible lightby at least partially coating the inside the shell 50 with phosphor, atleast partially coating the outside of the shell 50 with phosphor,doping the shell 50 with phosphor and/or coating the inside of a socket30 with phosphor. In a color panel, according to an embodiment of thepresent invention, colored phosphor is chosen so the visible lightemitted from alternating micro-components is colored red, green andblue, respectively. By combining these primary colors at varyingintensities, all colors can be formed. It is contemplated that othercolor combinations and arrangements may be used. In another embodimentfor a color light-emitting panel, the UV light is converted to visiblelight by disposing a single colored phosphor on the micro-component 40and/or on the inside of the socket 30. Colored filters may then bealternatingly applied over each socket 30 to convert the visible lightto colored light of any suitable arrangement, for example red, green andblue. By coating all the micro-components with a single colored phosphorand then converting the visible light to colored light by using at leastone filter applied over the top of each socket, micro-componentplacement is made less complicated and the light-emitting panel is moreeasily configurable.

To obtain an increase in luminosity and radiation transport efficiency,in an embodiment of the present invention, the shell 50 of eachmicro-component 40 is at least partially coated with a secondaryemission enhancement material. Any low affinity material may be usedincluding, but not limited to, magnesium oxide and thulium oxide. Oneskilled in the art would recognize that other materials will alsoprovide secondary emission enhancement. In another embodiment of thepresent invention, the shell 50 is doped with a secondary emissionenhancement material. It is contemplated that the doping of shell 50with a secondary emission enhancement material may be in addition tocoating the shell 50 with a secondary emission enhancement material. Inthis case, the secondary emission enhancement material used to coat theshell 50 and dope the shell 50 may be different.

In addition to, or in place of, doping the shell 50 with a secondaryemission enhancement material, according to an embodiment of the presentinvention, the shell 50 is doped with a conductive material. Possibleconductive materials include, but are not limited to silver, gold,platinum, and aluminum. Doping the shell 50 with a conductive materialprovides a direct conductive path to the gas or gas mixture contained inthe shell and provides one possible means of achieving a DClight-emitting panel.

In another embodiment of the present invention, the shell 50 of themicro-component 40 is coated with a reflective material. An indexmatching material that matches the index of refraction of the reflectivematerial is disposed so as to be in contact with at least a portion ofthe reflective material. The reflective coating and index matchingmaterial may be separate from, or in conjunction with, the phosphorcoating and secondary emission enhancement coating of previousembodiments. The reflective coating is applied to the shell 50 in orderto enhance radiation transport. By also disposing an index-matchingmaterial so as to be in contact with at least a portion of thereflective coating, a predetermined wavelength range of radiation isallowed to escape through the reflective coating at the interfacebetween the reflective coating and the index-matching material. Byforcing the radiation out of a micro-component through the interfacearea between the reflective coating and the index-matching materialgreater micro-component efficiency is achieved with an increase inluminosity. In an embodiment, the index matching material is coateddirectly over at least a portion of the reflective coating. In anotherembodiment, the index matching material is disposed on a material layer,or the like, that is brought in contact with the micro-component suchthat the index matching material is in contact with at least a portionof the reflective coating. In another embodiment, the size of theinterface is selected to achieve a specific field of view for thelight-emitting panel.

A cavity 55 formed within and/or on the first substrate 10 provides thebasic socket 30 structure. The cavity 55 may be any shape and size. Asdepicted in FIGS. 3A-3J, the shape of the cavity 55 may include, but isnot limited to, a cube 100, a cone 110, a conical frustum 120, aparaboloid 130, spherical 140, cylindrical 150, a pyramid 160, apyramidal frustum 170, a parallelepiped 180, or a prism 190.

The size and shape of the socket 30 influence the performance andcharacteristics of the light-emitting panel and are selected to optimizethe panel's efficiency of operation. In addition, socket geometry may beselected based on the shape and size of the micro-component to optimizethe surface contact between the micro-component and the socket and/or toensure connectivity of the micro-component and any electrodes disposedwithin the socket. Further, the size and shape of the sockets 30 may bechosen to optimize photon generation and provide increased luminosityand radiation transport efficiency. As shown by example in FIGS. 4 and5, the size and shape may be chosen to provide a field of view 400 witha specific angle θ, such that a micro-component 40 disposed in a deepsocket 30 may provide more collimated light and hence a narrower viewingangle θ (FIG. 4), while a micro-component 40 disposed in a shallowsocket 30 may provide a wider viewing angle θ (FIG. 5). That is to say,the cavity may be sized, for example, so that its depth subsumes amicro-component deposited in a socket, or it may be made shallow so thata micro-component is only partially disposed within a socket.Alternatively, in another embodiment of the present invention, the fieldof view 400 may be set to a specific angle θ by disposing on the secondsubstrate at least one optical lens. The lens may cover the entiresecond substrate or, in the case of multiple optical lenses, arranged soas to be in register with each socket. In another embodiment, theoptical lens or optical lenses are configurable to adjust the field ofview of the light-emitting panel.

In an embodiment for a method of making a light-emitting panel includinga plurality of sockets, a cavity 55 is formed, or patterned, in asubstrate 10 to create a basic socket shape. The cavity may be formed inany suitable shape and size by any combination of physically,mechanically, thermally, electrically, optically, or chemicallydeforming the substrate. Disposed proximate to, and/or in, each socketmay be a variety of enhancement materials 325. The enhancement materials325 include, but are not limited to, anti-glare coatings, touchsensitive surfaces, contrast enhancement coatings, protective coatings,transistors, integrated-circuits, semiconductor devices, inductors,capacitors, resistors, control electronics, drive electronics, diodes,pulse-forming networks, pulse compressors, pulse transformers, andtuned-circuits.

In another embodiment of the present invention for a method of making alight-emitting panel including a plurality of sockets, a socket 30 isformed by disposing a plurality of material layers 60 to form a firstsubstrate 10, disposing at least one electrode either directly on thefirst substrate 10, within the material layers or any combinationthereof, and selectively removing a portion of the material layers 60 tocreate a cavity. The material layers 60 include any combination, inwhole or in part, of dielectric materials, metals, and enhancementmaterials 325. The enhancement materials 325 include, but are notlimited to, anti-glare coatings, touch sensitive surfaces, contrastenhancement coatings, protective coatings, transistors,integrated-circuits, semiconductor devices, inductors, capacitors,resistors, control electronics, drive electronics, diodes, pulse-formingnetworks, pulse compressors, pulse transformers, and tuned-circuits. Theplacement of the material layers 60 may be accomplished by any transferprocess, photolithography, sputtering, laser deposition, chemicaldeposition, vapor deposition, or deposition using ink jet technology.One of general skill in the art will recognize other appropriate methodsof disposing a plurality of material layers on a substrate. The cavity55 may be formed in the material layers 60 by a variety of methodsincluding, but not limited to, wet or dry etching, photolithography,laser heat treatment, thermal form, mechanical punch, embossing,stamping-out, drilling, electroforming or by dimpling.

In another embodiment of the present invention for a method of making alight-emitting panel including a plurality of sockets, a socket 30 isformed by patterning a cavity 55 in a first substrate 10, disposing aplurality of material layers 65 on the first substrate 10 so that thematerial layers 65 conform to the cavity 55, and disposing at least oneelectrode on the first substrate 10, within the material layers 65, orany combination thereof. The cavity may be formed in any suitable shapeand size by any combination of physically, mechanically, thermally,electrically, optically, or chemically deforming the substrate. Thematerial layers 60 include any combination, in whole or in part, ofdielectric materials, metals, and enhancement materials 325. Theenhancement materials 325 include, but are not limited to, anti-glarecoatings, touch sensitive surfaces, contrast enhancement coatings,protective coatings, transistors, integrated-circuits, semiconductordevices, inductors, capacitors, resistors, control electronics, driveelectronics, diodes, pulse-forming networks, pulse compressors, pulsetransformers, and tuned-circuits. The placement of the material layers60 may be accomplished by any transfer process, photolithography,sputtering, laser deposition, chemical deposition, vapor deposition, ordeposition using ink jet technology. One of general skill in the artwill recognize other appropriate methods of disposing a plurality ofmaterial layers on a substrate.

In another embodiment of the present invention for a method of making alight-emitting panel including a plurality of sockets, a socket 30 isformed by disposing a plurality of material layers 66 on a firstsubstrate 10 and disposing at least one electrode on the first substrate10, within the material layers 66, or any combination thereof. Each ofthe material layers includes a preformed aperture 56 that extendsthrough the entire material layer. The apertures may be of the same sizeor may be of different sizes. The plurality of material layers 66 aredisposed on the first substrate with the apertures in alignment therebyforming a cavity 55. The material layers 66 include any combination, inwhole or in part, of dielectric materials, metals, and enhancementmaterials 325. The enhancement materials 325 include, but are notlimited to, anti-glare coatings, touch sensitive surfaces, contrastenhancement coatings, protective coatings, transistors,integrated-circuits, semiconductor devices, inductors, capacitors,resistors, diodes, control electronics, drive electronics, pulse-formingnetworks, pulse compressors, pulse transformers, and tuned-circuits. Theplacement of the material layers 66 may be accomplished by any transferprocess, photolithography, sputtering, laser deposition, chemicaldeposition, vapor deposition, or deposition using ink jet technology.One of general skill in the art will recognize other appropriate methodsof disposing a plurality of material layers on a substrate.

In the above embodiments describing four different methods of making asocket in a light-emitting panel, disposed in, or proximate to, eachsocket may be at least one enhancement material. As stated above theenhancement material 325 may include, but is not limited to, anti-glarecoatings, touch sensitive surfaces, contrast enhancement coatings,protective coatings, transistors, integrated-circuits, semiconductordevices, inductors, capacitors, resistors, control electronics, driveelectronics, diodes, pulse-forming networks, pulse compressors, pulsetransformers, and tuned-circuits. In a preferred embodiment of thepresent invention the enhancement materials may be disposed in, orproximate to each socket by any transfer process, photolithography,sputtering, laser deposition, chemical deposition, vapor deposition,deposition using ink jet technology, or mechanical means. In anotherembodiment of the present invention, a method for making alight-emitting panel includes disposing at least one electricalenhancement (e.g. the transistors, integrated-circuits, semiconductordevices, inductors, capacitors, resistors, control electronics, driveelectronics, diodes, pulse-forming networks, pulse compressors, pulsetransformers, and tuned-circuits), in, or proximate to, each socket bysuspending the at least one electrical enhancement in a liquid andflowing the liquid across the first substrate. As the liquid flowsacross the substrate the at least one electrical enhancement will settlein each socket. It is contemplated that other substances or means may beuse to move the electrical enhancements across the substrate. One suchmeans may include, but is not limited to, using air to move theelectrical enhancements across the substrate. In another embodiment ofthe present invention the socket is of a corresponding shape to the atleast one electrical enhancement such that the at least one electricalenhancement self-aligns with the socket.

The electrical enhancements may be used in a light-emitting panel for anumber of purposes including, but not limited to, lowering the voltagenecessary to ionize the plasma-forming gas in a micro-component,lowering the voltage required to sustain/erase the ionization charge ina micro-component, increasing the luminosity and/or radiation transportefficiency of a micro-component, and augmenting the frequency at which amicro-component is lit. In addition, the electrical enhancements may beused in conjunction with the light-emitting panel driving circuitry toalter the power requirements necessary to drive the light-emittingpanel. For example, a tuned-circuit may be used in conjunction with thedriving circuitry to allow a DC power source to power an AC-typelight-emitting panel. In an embodiment of the present invention, acontroller is provided that is connected to the electrical enhancementsand capable of controlling their operation. Having the ability toindividual control the electrical enhancements at each pixel/subpixelprovides a means by which the characteristics of individualmicro-components may be altered/corrected after fabrication of thelight-emitting panel. These characteristics include, but are not limitedto, luminosity and the frequency at which a micro-component is lit. Oneskilled in the art will recognize other uses for electrical enhancementsdisposed in, or proximate to, each socket in a light-emitting panel.

The electrical potential necessary to energize a micro-component 40 issupplied via at least two electrodes. In a general embodiment of thepresent invention, a light-emitting panel includes a plurality ofelectrodes, wherein at least two electrodes are adhered to only thefirst substrate, only the second substrate or at least one electrode isadhered to each of the first substrate and the second substrate andwherein the electrodes are arranged so that voltage applied to theelectrodes causes one or more micro-components to emit radiation. Inanother general embodiment, a light-emitting panel includes a pluralityof electrodes, wherein at least two electrodes are arranged so thatvoltage supplied to the electrodes cause one or more micro-components toemit radiation throughout the field of view of the light-emitting panelwithout crossing either of the electrodes.

In an embodiment where the sockets 30 are patterned on the firstsubstrate 10 so that the sockets are formed in the first substrate, atleast two electrodes may be disposed on the first substrate 10, thesecond substrate 20, or any combination thereof. In exemplaryembodiments as shown in FIGS. 1 and 2, a sustain electrode 70 is adheredon the second substrate 20 and an address electrode 80 is adhered on thefirst substrate 10. In a preferred embodiment, at least one electrodeadhered to the first substrate 10 is at least partly disposed within thesocket (FIGS. 1 and 2).

In an embodiment where the first substrate 10 includes a plurality ofmaterial layers 60 and the sockets 30 are formed within the materiallayers, at least two electrodes may be disposed on the first substrate10, disposed within the material layers 60, disposed on the secondsubstrate 20, or any combination thereof. In one embodiment, as shown inFIG. 6A, a first address electrode 80 is disposed within the materiallayers 60, a first sustain electrode 70 is disposed within the materiallayers 60, and a second sustain electrode 75 is disposed within thematerial layers 60, such that the first sustain electrode and the secondsustain electrode are in a co-planar configuration. FIG. 6B is acut-away of FIG. 6A showing the arrangement of the co-planar sustainelectrodes 70 and 75. In another embodiment, as shown in FIG. 7A, afirst sustain electrode 70 is disposed on the first substrate 10, afirst address electrode 80 is disposed within the material layers 60,and a second sustain electrode 75 is disposed within the material layers60, such that the first address electrode is located between the firstsustain electrode and the second sustain electrode in a mid-planeconfiguration. FIG. 7B is a cut-away of FIG. 7A showing the firstsustain electrode 70. As seen in FIG. 8, in a preferred embodiment ofthe present invention, a first sustain electrode 70 is disposed withinthe material layers 60, a first address electrode 80 is disposed withinthe material layers 60, a second address electrode 85 is disposed withinthe material layers 60, and a second sustain electrode 75 is disposedwithin the material layers 60, such that the first address electrode andthe second address electrode are located between the first sustainelectrode and the second sustain electrode.

In an embodiment where a cavity 55 is patterned on the first substrate10 and a plurality of material layers 65 are disposed on the firstsubstrate 10 so that the material layers conform to the cavity 55, atleast two electrodes may be disposed on the first substrate 10, at leastpartially disposed within the material layers 65, disposed on the secondsubstrate 20, or any combination thereof. In one embodiment, as shown inFIG. 9, a first address electrode 80 is disposed on the first substrate10, a first sustain electrode 70 is disposed within the material layers65, and a second sustain electrode 75 is disposed within the materiallayers 65, such that the first sustain electrode and the second sustainelectrode are in a co-planar configuration. In another embodiment, asshown in FIG. 10, a first sustain electrode 70 is disposed on the firstsubstrate 10, a first address electrode 80 is disposed within thematerial layers 65, and a second sustain electrode 75 is disposed withinthe material layers 65, such that the first address electrode is locatedbetween the first sustain electrode and the second sustain electrode ina mid-plane configuration. As seen in FIG. 11, in a preferred embodimentof the present invention, a first sustain electrode 70 is disposed onthe first substrate 10, a first address electrode 80 is disposed withinthe material layers 65, a second address electrode 85 is disposed withinthe material layers 65, and a second sustain electrode 75 is disposedwithin the material layers 65, such that the first address electrode andthe second address electrode are located between the first sustainelectrode and the second sustain electrode.

In an embodiment where a plurality of material layers 66 with alignedapertures 56 are disposed on a first substrate 10 thereby creating thecavities 55, at least two electrodes may be disposed on the firstsubstrate 10, at least partially disposed within the material layers 65,disposed on the second substrate 20, or any combination thereof. In oneembodiment, as shown in FIG. 14, a first address electrode 80 isdisposed on the first substrate 10, a first sustain electrode 70 isdisposed within the material layers 66, and a second sustain electrode75 is disposed within the material layers 66, such that the firstsustain electrode and the second sustain electrode are in a co-planarconfiguration. In another embodiment, as shown in FIG. 15, a firstsustain electrode 70 is disposed on the first substrate 10, a firstaddress electrode 80 is disposed within the material layers 66, and asecond sustain electrode 75 is disposed within the material layers 66,such that the first address electrode is located between the firstsustain electrode and the second sustain electrode in a mid-planeconfiguration. As seen in FIG. 16, in a preferred embodiment of thepresent invention, a first sustain electrode 70 is disposed on the firstsubstrate 10, a first address electrode 80 is disposed within thematerial layers 66, a second address electrode 85 is disposed within thematerial layers 66, and a second sustain electrode 75 is disposed withinthe material layers 66, such that the first address electrode and thesecond address electrode are located between the first sustain electrodeand the second sustain electrode.

The specification, above, has described, among other things, variouscomponents of a light-emitting panel and methodologies to make thosecomponents and to make a light-emitting panel. In an embodiment of thepresent invention, it is contemplated that those components may bemanufactured and those methods for making may be accomplished as part ofweb fabrication process for manufacturing light-emitting panels. Inanother embodiment of the present invention, a web fabrication processfor manufacturing light-emitting panels includes the steps of providinga first substrate, disposing micro-components on the first substrate,disposing a second substrate on the fust substrate so that themicro-components are sandwiched between the first and second substrates,and dicing the first and second substrate “sandwich” to form individuallight-emitting panels. In another embodiment, the first and secondsubstrates are provided as rolls of material. A plurality of sockets mayeither be preformed on the first substrate or may be formed in and/or onthe first substrate as part of the web fabrication process. Likewise,the first and second substrates may be preformed so that the fistsubstrate, the second substrate or both substrates include a pluralityof electrodes. Alternatively, a plurality of electrodes may be disposedon or within the first substrate, on or within the second substrate, oron and within both the first substrate and second substrate as part ofthe web fabrication process. It should be noted that where suitable,fabrication steps may be performed in any order. It should also be notedthat the micro-components may be preformed or may be formed as part ofthe web fabrication process. In another embodiment, the web fabricationprocess is performed as a continuous high-speed incline process with theability to manufacture light-emitting panels at a rate faster thanlight-emitting panels manufactured as part of batch process.

As shown in FIGS. 12 and 13, in an embodiment of the present invention,the web fabrication process includes the following process steps: amicro-component forming process 800 for forming the micro-componentshells and filling the micro-components with plasma-forming gas; amicro-component coating process 810 for coating the micro-componentswith phosphor or any other suitable coatings and producing a pluralityof coated and filled micro-components 400; a circuit and electrodeprinting process 820 for printing at least one electrode and any neededdriving and control circuitry on a first substrate 420; a patterningprocess 840 for patterning a plurality of cavities on a first substrateto form a plurality of sockets 430; a micro-component placement process850 for properly placing at least one micro-component in each socket430; an electrode printing process 860 for printing, if required, atleast one electrode on a second substrate 410; a second substrateapplication and alignment process 870 for aligning the second substrateover the first substrate 440 so that the micro-components are sandwichedbetween the first substrate and the second substrate 450; and a paneldicing process 880 for dicing the first and second substrates 450 toform individual light-emitting panels 460.

In another embodiment of the present invention as shown in FIG. 17, thesocket 30 may be formed as a type of male-female connector with a malemicro-component 40 and a female cavity 55. The male micro-component 40and female cavity 55 are formed to have complimentary shapes. As shownin FIG. 12, as an example, both the cavity and micro-component havecomplimentary cylindrical shapes. The opening 35 of the female cavity isformed such that the opening is smaller than the diameter d of the malemicro-component. The larger diameter male micro-component can be forcedthrough the smaller opening of the female cavity 55 so that the malemicro-component 40 is locked/held in the cavity and automaticallyaligned in the socket with respect to at least one electrode 500disposed therein. This arrangement provides an added degree offlexibility for micro-component placement. In another embodiment, thissocket structure provides a means by which cylindrical micro-componentsmay be fed through the sockets on a row-by-row basis or in the case of asingle long cylindrical micro-component (although other shapes wouldwork equally well) fed/woven throughout the entire light-emitting panel.

In another embodiment of the present invention, as shown in FIG. 18, amethod for making a light-emitting panel includes weaving a singlemicro-component 40 through each socket 30 for the entire length of thelight-emitting panel. Any socket 30 formed in the shape of a channelwill work equally well in this embodiment. In a preferred embodiment,however, the socket illustrates in FIG. 17, and described above, isused. As the single micro-component 40 is being woven/fed through thesocket channels and as the single micro-component reaches the end of achannel, it is contemplated in an embodiment that the micro-component 40will be heat treated so as to allow the micro-component 40 to bendaround the end of the socket channel. In another embodiment, as shown inFIG. 19, a method for making a color light-emitting panel includesweaving a plurality of micro-components 40, each configured to emit aspecific color of visible light, alternatingly through the entirelight-emitting panel. For example, as shown in FIG. 19, a redmicro-component 41, a green micro-component 42 and a bluemicro-component 43 are woven/fed through the socket channels.Alternatively, a color light-emitting panel may be made by alternatinglycoating the inside of each socket channel with a specific color phosphoror other UV conversion material, and then weaving/feeding a plurality ofmicro-components through the socket channels for the entire length ofthe light-emitting panel.

Other embodiments and uses of the present invention will be apparent tothose skilled in the art from consideration of this application andpractice of the invention disclosed herein. The present description andexamples should be considered exemplary only, with the true scope andspirit of the invention being indicated by the following claims. As willbe understood by those of ordinary skill in the art, variations andmodifications of each of the disclosed embodiments, includingcombinations thereof, can be made within the scope of this invention asdefined by the following claims.

1. A curing or sterilization device comprising a light-emitting panel,wherein the light-emitting panel comprises: a first substrate, whereinthe first substrate comprises a plurality of sockets; a plurality ofmicro-components, wherein each micro-component comprises a shell atleast partially filled with a plasma-forming gas, wherein themicro-component is configured to emit ultraviolet light, and wherein atleast one micro-component of the plurality of micro-components is atleast partially disposed in each socket; a second substrate, wherein thesecond substrate is opposed to the first substrate such that at leastone micro-component is sandwiched between the first substrate and thesecond substrate; and a plurality of electrodes, wherein at least twoelectrodes of the plurality of electrodes are adhered to only the firstsubstrate or only the second substrate so that voltage supplied to theat least two electrodes causes one or more micro-components to emit theultra-violet light.
 2. The curing or sterilization device of claim 1,wherein the ultraviolet light is emitted throughout the filed of view ofthe light-emitting panel without crossing the at least two electrodes.3. A device for curing or sterilizing using ultraviolet radiationcomprising: a plurality of micro-components for emitting ultravioletradiation, wherein each of the plurality of micro-components comprises ashell that is at least partially filled with an ionizable gas; means forionizing the ionizable gas and causing the plurality of micro-componentsto emit ultraviolet radiation; and means for directing the emittedultraviolet radiation through a field of view, wherein the means forionizing the ionizable gas is not located within the field of view. 4.The device according to claim 3, wherein the means for directing theemitted ultraviolet radiation comprises a first substrate having aplurality of sockets formed therein, wherein at least one of theplurality of micro-components is at least partially disposed in each ofthe plurality of sockets.
 5. The device according to claim 4, whereineach of the plurality of sockets contains a material that reflectsultraviolet radiation.
 6. The device according to claim 4, wherein thereare at least two micro-components at least partially disposed in each ofthe plurality of sockets.
 7. The device according to claim 3, whereinthe means for ionizing the ionizable gas comprises at least twoelectrodes configured so as to provide a potential across the ionizablegas.
 8. The device according to claim 3, wherein the means for ionizingthe ionizable gas is formed of a material that is transparent toultraviolet radiation.
 9. The device according to claim 3, wherein theionizable gas has a pressure within the range of approximately 100 tonto 700 ton.
 10. The device according to claim 3, wherein the ionizablegas is comprised at least in part of at least one noble gas.
 11. Thedevice according to claim 4, wherein the shell of each of the pluralityof micro-components is at least partially coated with a secondaryemission enhancement material.
 12. The device according to claim 11,wherein the secondary emission enhancement material is a low affinitymaterial.
 13. The device according to claim 3, wherein the shell of eachof the plurality of micro-components is doped with a secondary emissionenhancement material.
 14. The device according to claim 13, wherein thesecondary emission enhancement material is a low affinity material.